BÖHLER P810 is a Fe-Ni-Co alloy with a low and stable coefficient of thermal expansion in the temperature range from -100 to +450°C.Some technical ceramics (e.g. aluminium oxide, aluminium nitride, borosilicate glasses and semiconductor materials) show coefficients of thermal expansion of the same order of magnitude.
The alloy is therefore used for metal-glass seals of electronic components, material transitions in vacuum chambers, X-ray tubes, transistor sockets and similar.
In the field of microelectronics and microsystems technology, BÖHLER P810 is used as a housing material or as a submount, i.e. an intermediate layer between the actual carrier material and material with a usually significantly higher coefficient of expansion, and serves as a compensating element that absorbs or reduces the thermomechanical stresses caused by the different coefficients of thermal expansion of other materials.
Airmelted
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